2 Complete range of Yamaha SMT mounters from Amistar Automation
760.471.1700


Amistar Automation is proud to offer the complete line of Flip Chip bonders from Yamaha.

YSB55W
High-Speed & High-Accuracy Flip Chip Bonder

High bonding accuracy and x3 productivity of conventional machines!
This brings a New Era in Semiconductor packaging for the expanding flip chip market.

High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH

High-Accuracy ±5μm (3σ)

High-Quality & Flexibility

 

 


 

YSH20
High-speed, high-precision flipchip hybrid placer

4,500 UPH (0.8 sec/unit); the top mounting capability in flipchip bonders

+/- 10 µm (3σ) mounting accuracy

YWF wafer supply unit “6/8/12 inch”, “expand ring”, and “θ angle correction” applicable

0.6 × 0.6 mm to 18 × 18 mm components applicable

 

 


 

 

 

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