Shown with optional cabinet.
This in-line reflow oven affords non-polluting, lead free soldering of complex boards with components like QFP, BGA/CSPs. Optimal for processing small & medium batches.
The basic machine is constructed as a tabletop unit & disposes of the need for a heating chamber with 8 heating zones; in each case four on top/bottom. The heating zones emit convective heat with the help of a hot air blower.
The upper part of the heating chamber includes an additional cooling zone & an exhaust air bonnet in the lead-in & lead-out area.
The soldering system is controlled by a modern 7” touch panel. A one-channel temperature sensor is integrated for controlling the contour of soldering on the PCB.